JPH0149032B2 - - Google Patents
Info
- Publication number
- JPH0149032B2 JPH0149032B2 JP18206185A JP18206185A JPH0149032B2 JP H0149032 B2 JPH0149032 B2 JP H0149032B2 JP 18206185 A JP18206185 A JP 18206185A JP 18206185 A JP18206185 A JP 18206185A JP H0149032 B2 JPH0149032 B2 JP H0149032B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- temperature
- paint
- preheating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003973 paint Substances 0.000 claims description 19
- 238000009826 distribution Methods 0.000 claims description 7
- 238000010521 absorption reaction Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000006071 cream Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18206185A JPS6242595A (ja) | 1985-08-20 | 1985-08-20 | 印刷配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18206185A JPS6242595A (ja) | 1985-08-20 | 1985-08-20 | 印刷配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6242595A JPS6242595A (ja) | 1987-02-24 |
| JPH0149032B2 true JPH0149032B2 (en]) | 1989-10-23 |
Family
ID=16111659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18206185A Granted JPS6242595A (ja) | 1985-08-20 | 1985-08-20 | 印刷配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6242595A (en]) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6439090A (en) * | 1987-08-05 | 1989-02-09 | Matsushita Electric Ind Co Ltd | Substrate for reflow |
| JP4733253B2 (ja) * | 2000-09-29 | 2011-07-27 | イビデン株式会社 | プリント配線板 |
| JP2018078244A (ja) * | 2016-11-11 | 2018-05-17 | 新電元工業株式会社 | 電子装置の製造方法および電子装置 |
-
1985
- 1985-08-20 JP JP18206185A patent/JPS6242595A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6242595A (ja) | 1987-02-24 |
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